find a flux additional parameters osp pad finish is used pcb is reflowed before wave soldering pcb is > " ( mm)thick pcb has + copper layers wave solder contact time is > seconds selective soldering on main wave using pallet type carriers in circuit testing (ict) is done with pins transparent flux residues...
find a flux additional parameters osp pad finish is used pcb is reflowed before wave soldering pcb is > " ( mm)thick pcb has + copper layers wave solder contact time is > seconds selective soldering on main wave using pallet type carriers in circuit testing (ict) is done with pins transparent flux residues...
find a flux additional parameters osp pad finish is used pcb is reflowed before wave soldering pcb is > " ( mm)thick pcb has + copper layers wave solder contact time is > seconds selective soldering on main wave using pallet type carriers in circuit testing (ict) is done with pins transparent flux residues...
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ukraine united arab emirates united kingdom uruguay us minor outlying islands uzbekistan vanuatu venezuela vietnam virgin islands, british virgin islands, u.s. wallis and futuna western sahara yemen zambia zimbabwe scrap metal recycling global recycling network | policies and procedures metal content residues...
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general meeting policies & charters risk management responsible investing reports & presentations company announcements & news financial calendar capital markets day subscription contact explorez investors portuguese russian chinese german spanish english food cultures & enzymes control of antibiotic residues...
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