Search Results for: Mercuric oxide cells batteries
processes using dry etching technologies are slower than acid decapping processes, however the processes can remove a specific material layer and reveal under-layers and metal lines with high selectivity. plasma decapsulation solutions highly selective etching and removal of various materials si, oxide
, nitride, imd, ild, low k, polyimide, epoxy using plasma etching technologies, our decap processes can remove various materials with high selectivity and high aspect ratio. si (etch stop at buried oxide (box)) oxide borosilicate glass (bsg), phosphosilicate glass (psg) and borophosphosilicate glass...
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