design and, as a consequence, is even able to cope with extreme loads. in addition, thanks to optimised injection moulding technology, it is more cost-effective than comparable resistant fibre composites. e-skin flat e-skin flat - fits even into the smallest installation spaces – ideal for the semiconductor...
fabrication and packaging materials semiconductor fabrication and packaging materials view all semiconductor fabrication and packaging materials materials for chemical mechanical planarization (cmp) materials for chemical mechanical planarization (cmp) view all materials for chemical mechanical planarization...
silicon with dangling bond modifier) (class / ) field effect device in non-single crystal, or recrystallized, semiconductor material (class / ) schottky barrier to polycrystalline semiconductor material (class / ) plural recrystallized semiconductor layers (e.g., " -dimensional integrated circuit")...