Search Results for: Photosensitive semiconductor devices
imaps presents:thin is in – the challenge and solution of picking thinner die, by sarah parrish, senior sales applications engineer, royce instruments wednesday, may , / : am – : pm semi global headquarters south milpitas blvd milpitas, ca to meet today's device performance and packaging demands, devices
are getting thinner at the wafer level. this trend can be seen in wide range of applications spanning multiple industries including medical devices, wearables, power devices, military/space, and automotive and multiple materials including gan, inp, and si. with thinner devices allowing improved performance...
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