Compound optical

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view all semiconductor assembly materials thermal interface materials lid seal adhesives die attach adhesives die encapsulants permanent bonding dielectrics semiconductor silicone materials semiconductor silicone materials view all semiconductor silicone materials si precursors spin-on dielectrics compound

semiconductor compound semiconductor view all compound semiconductor silicon carbide wafers & epitaxy thick film materials thick film materials view all thick film materials hybrid circuit materials hybrid circuit materials view all hybrid circuit materials thick film resistor materials laser structurable...

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view all semiconductor assembly materials thermal interface materials lid seal adhesives die attach adhesives die encapsulants permanent bonding dielectrics semiconductor silicone materials semiconductor silicone materials view all semiconductor silicone materials si precursors spin-on dielectrics compound

semiconductor compound semiconductor view all compound semiconductor silicon carbide wafers & epitaxy thick film materials thick film materials view all thick film materials hybrid circuit materials hybrid circuit materials view all hybrid circuit materials thick film resistor materials laser structurable...

https://www.dupont.com/products/thick-film-resistor-materials.html

view all semiconductor assembly materials thermal interface materials lid seal adhesives die attach adhesives die encapsulants permanent bonding dielectrics semiconductor silicone materials semiconductor silicone materials view all semiconductor silicone materials si precursors spin-on dielectrics compound

semiconductor compound semiconductor view all compound semiconductor silicon carbide wafers & epitaxy thick film materials thick film materials view all thick film materials hybrid circuit materials hybrid circuit materials view all hybrid circuit materials thick film resistor materials laser structurable...

https://www.dupont.com/products/tin-electroplating.html

view all semiconductor assembly materials thermal interface materials lid seal adhesives die attach adhesives die encapsulants permanent bonding dielectrics semiconductor silicone materials semiconductor silicone materials view all semiconductor silicone materials si precursors spin-on dielectrics compound

semiconductor compound semiconductor view all compound semiconductor silicon carbide wafers & epitaxy thick film materials thick film materials view all thick film materials hybrid circuit materials hybrid circuit materials view all hybrid circuit materials thick film resistor materials laser structurable...

https://www.dupont.com/products/visionpad-polishing-pads.html

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material (class / ) plural recrystallized semiconductor layers (e.g., " -dimensional integrated circuit") (class / ) recrystallized semiconductor material (class / ) specified wide band gap ( . ev) semiconductor material other than gaasp or gaalas (class / ) diamond or silicon carbide (class / ) ii-vi compound

emitter structure (class / ) in combination with or also constituting light responsive device (class / ) active layer of indirect band gap semiconductor (class / ) plural light emitting devices (e.g., matrix, -segment array) (class / ) with heterojunction (class / ) with reflector, opaque mask, or optical...

https://patents.justia.com/patents-by-us-classification/257

justia patents electrolysis: processes, compositions used therein, and methods of preparing the compositions patents (class ) electrolysis: processes, compositions used therein, and methods of preparing the compositions patents (class ) electrolytic process involving actinide series elements or compound

mold, mask, or masterform (class / ) mirror or reflector (class / ) ornamental article (class / ) roll, ring, or hollow body (class / ) powder, flakes, or colloidal particles (class / ) perforated or foraminous article (class / ) sheet, web, wire, or filament (class / ) electrical product (class / ) optical...

https://patents.justia.com/patents-by-us-classification/205

html open accessarticle annular surface micromachining of titanium tubes using a magnetorheological polishing technique by wanli song , zhen peng , peifan li , pei shi and seung-bok choi micromachines , ( ), ; - mar abstract in this study, a novel magnetorheological (mr) polishing device under a compound

magnetic field is designed to achieve microlevel polishing of the titanium tubes. the polishing process is realized by combining the rotation motion of the tube and the reciprocating linear motion of [...] read more. in this study, a novel magnetorheological (mr) polishing device under a compound magnetic...

https://www.mdpi.com/journal/micromachines