Search Results for: Resistors
passives, and encapsulants. available in multiple thicknesses, greentapetm is designed for use as an insulating layer in a wide variety of applications such as multichip modules, single chip packages, ceramic printed wiring boards, and rf modules. features include: component integration – buried resistors
passives, and encapsulants. available in multiple thicknesses, greentapetm is designed for use as an insulating layer in a wide variety of applications such as multichip modules, single chip packages, ceramic printed wiring boards, and rf modules. features include: component integration – buried resistors...
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