Semiconductor device manufacture machine

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core-shell bonding material"). these new products are expected to be adopted for next-generation power modules such as high-output motor power control inverters for hybrid vehicles. with the accelerated spread of high-output motor power control inverter modules and the like, the use of high-temperature semiconductor

devices (fig. 3), including silicon carbide (sic) and gallium nitride (gan), capable of operating in high-temperature environments of 200 or greater has been expected to expand. however, in such high-temperature environments, lead-free solder, conventionally used as a device bonding material, is unable...

http://www.mmc.co.jp/corporate/en/news/2019/news20190402.html

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