Search Results for: Parts for semiconductor devices
are getting thinner at the wafer level. this trend can be seen in wide range of applications spanning multiple industries including medical devices, wearables, power devices, military/space, and automotive and multiple materials including gan, inp, and si. with thinner devices allowing improved performance
, device flexibility, and reduced package size, implementation of this process requires a robust, high yield process for removal of the devices from the wafer tape after singulation. in this presentation the die removal process will be considered including upstream processing, tooling design, and machine...
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