Instruments for checking semiconductor wafers

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module manufacturing with actual placement speeds of up to passives per hour and bonding speeds up to flip chips per hour and defect rates lower than defect per million, the k&s ap-hybrid solutions give you the best of both worlds. wafer level packaging (wlp) bonding flip chips and/or passives onto wafers

or panels processing wafers sizes up to " and larger cam-x and secs-gem compatible feeding from wafer, waffle pack, tray or tape and reel full controlled placement force for thin flip chips or low profile passives full traceability fine pitch copper pillar bumps mcm & sip/fc bga/fc-csp/ fc-memory/fcob...

https://www.kns.com/Products/Equipment/Advanced-Packaging-(Hybrid)

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