Search Results for: Wafers
application spectrum besides metals, a wide range of other materials can be cut with laser, including semiconductors, plastics, organic materials, ceramics, paper, graphite, diamonds as well as composite materials. laser cutting of silicon laser cutting of silicon mono and poly-crystalline silicon wafers
application spectrum besides metals, a wide range of other materials can be cut with laser, including semiconductors, plastics, organic materials, ceramics, paper, graphite, diamonds as well as composite materials. laser cutting of silicon laser cutting of silicon mono and poly-crystalline silicon wafers...
https://www.rofin.com/en/applications/laser-cutting/other-materials/