Search Results for: Resistors
performance throughout the entire interconnect system. backplane fabrication sanmina provides quick turn and production backplanes including: ul® ready hybrid constructions integrating fr , low-loss laminates, blind and buried vias, pth signal integrity optimization, buried capacitance®, thick-film resistors
performance throughout the entire interconnect system. backplane fabrication sanmina provides quick turn and production backplanes including: ul® ready hybrid constructions integrating fr , low-loss laminates, blind and buried vias, pth signal integrity optimization, buried capacitance®, thick-film resistors...
https://www.sanmina.com/contract-manufacturing-design/backplanes/
laminates, pth signal integrity optimization and rohs-compliant surface finishes. backplane fabrication capability includes + layers in panel sizes up to inches with ultra-high aspect ratio (> : ), hdi, any layer via structures, backdrilling, blind via formation, buried capacitance® and buried thin film resistors
laminates, pth signal integrity optimization and rohs-compliant surface finishes. backplane fabrication capability includes + layers in panel sizes up to inches with ultra-high aspect ratio (> : ), hdi, any layer via structures, backdrilling, blind via formation, buried capacitance® and buried thin film resistors...
https://www.sanmina.com/solutions-contract-manufacturing-design/interconnect/