Parts for semiconductor devices

Parts for semiconductor devices

Search Results for: Parts for semiconductor devices
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manufacturing. the term back end is also used to refer to those parts of chip manufacturing after the wafer is complete, i.e. dicing, packaging and test. bin yield in led manufacturing, the proportion of devices made on wafer that meet the desired specification for wavelength, luminous efficacy and
in response to an applied electric field. the conductivity of a material is proportional to mobility multiplied by the concentration of carriers. high mobility is highly desirable in semiconductor devices because it leads to higher device performance through faster transistor switching. cassette a metal...
http://www.appliedmaterials.com/resources/glossary
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